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Engineer, High Bandwidth Memory(HBM) Package PE - Job Opportunity at Micron Technology, Inc.

Singapore, Singapore
Full-time
Senior
Posted: March 7, 2025
On-site
SGD 180,000 - 250,000 annually based on Singapore semiconductor industry standards for senior engineering roles

Benefits

Comprehensive healthcare benefits typical of multinational semiconductor companies
Professional development and training opportunities
Global mobility opportunities with international exposure
Competitive compensation package aligned with semiconductor industry standards
Innovation-focused work environment with access to cutting-edge technology

Key Responsibilities

Lead HBM Package PE team in driving quality improvements and yield optimization
Manage assembly-related coverage to improve Time 0 and Field DPM metrics
Drive HBM Cube on Wafer Assembly Yield Loss reduction through test coverage optimization
Collaborate with cross-functional teams for cumulative yield ownership
Oversee qualification processes and RMA packaging issues
Implement advanced data analysis using machine learning/AI for yield improvement
Develop and mentor team members while fostering innovation

Requirements

Education

Bachelors/Masters in Electrical and Electronics Engineering Degree or related field

Experience

Senior level experience in semiconductor packaging

Required Skills

Strong Leadership Skills Technical expertise in semiconductor packaging Cross-functional collaboration abilities Statistical analysis and data interpretation Process optimization experience Problem-solving capabilities Adaptability in dynamic environments
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Sauge AI Market Intelligence

Industry Trends

The HBM market is experiencing rapid growth driven by AI and high-performance computing demands, with a projected CAGR of over 30% through 2025 Integration of AI/ML in semiconductor manufacturing processes is becoming a critical differentiator for yield optimization Increasing focus on advanced packaging solutions as a key enabler for next-generation computing architectures Growing emphasis on sustainability and energy efficiency in memory solutions

Role Significance

Likely leading a team of 5-8 direct reports with matrix management responsibility across multiple functions
Senior technical leadership position with significant impact on product quality and manufacturing efficiency

Key Projects

HBM next-generation product development initiatives Manufacturing yield optimization programs Quality improvement and cost reduction projects Cross-site technology transfer and standardization efforts

Success Factors

Deep technical expertise in advanced packaging technologies Strong program management capabilities Ability to navigate complex organizational structures Data-driven decision-making approach Excellence in stakeholder management across global teams

Market Demand

Very high demand due to global focus on AI/ML hardware acceleration and limited talent pool in advanced memory packaging

Important Skills

Critical Skills

Advanced packaging expertise Yield optimization experience Cross-functional leadership Statistical analysis capabilities Problem-solving methodology

Beneficial Skills

Machine learning/AI knowledge Industry 4.0 familiarity Project management certification Six Sigma methodology

Unique Aspects

Direct involvement in cutting-edge HBM technology development
Opportunity to influence next-generation memory solutions
Global exposure with significant interaction with teams in Taiwan
Integration of advanced analytics and AI in manufacturing processes

Career Growth

2-4 years in role before advancement opportunities, depending on business growth and performance

Potential Next Roles

Director of Package Engineering Senior Technical Program Manager Head of Memory Solutions Technical Director

Company Overview

Micron Technology, Inc.

Micron is one of the world's largest semiconductor companies, specializing in memory and storage solutions

Global leader in memory solutions with strong competitive position in HBM market
Singapore serves as a critical R&D and manufacturing hub for Micron's advanced memory solutions
Innovation-driven environment with strong emphasis on technical excellence and collaborative problem-solving
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